The Moulded Case Stress at High Ambient Temperature Test System is a compact, bench‑top rig that evaluates how moulded plastic housings and moulded‑case circuit breaker (MCCB/MCB) enclosures withstand sustained mechanical load while exposed to elevated ambient temperatures. It applies a controlled compressive force to the specimen and maintains a programmable high‑temperature environment to simulate worst‑case service conditions—such as installation in hot switchboards, poorly ventilated cabinets, or high‑ambient industrial sites. The system monitors the specimen for dimensional drift, creep, cracking, latch/handle misalignment, and functional impairment during and after exposure.
Specification/Features
- Set‑point range: Ambient +5 °C to 120 °C (optional 150 °C)
- Control accuracy: ±1.0 °C
- Uniformity around specimen: ±2.0 °C (with airflow mixing)
- Display: Digital temperature indicator on front panel
- Profiles: Fixed set‑point; optional linear ramp (0.5–3 °C/min)
- Dwell timer: 1 min to 9999 min (HH:MM selectable)
