The Temperature Cycling Test System is a compact, bench‑top environmental chamber designed to repeatedly cycle the temperature of a device under test (DUT) between programmable low and high set‑points. By controlling ramp rates, dwell times, and number of cycles, it accelerates thermal fatigue mechanisms such as material expansion/contraction, solder joint fatigue, seal stress, and condensation effects, helping predict field reliability and verify compliance with environmental test standards.
Specification/Features
- Operating range: −40 °C to +150 °C (opƟonal −70 °C to +180 °C)
- Control accuracy: ±0.5 °C
- Chamber uniformity: ±1.0 to ±2.0 °C (steady state, empty chamber)
- Ramp rate (nominal): up to 2 °C/min heat and 2 °C/min
- cool (profile‑dependent and load‑dependent)
- Set‑point resolution: 0.1 °C
- Stabilization time: ≤ 10 min to within stability band after
- set‑point change (typical)
